• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Method for securing an RFID chip (2) as an identification feature on a stamp plate (1), preferably for a hand stamp, wherein the RFID chip (2) is connected to the stamp plate (1) substantially inseparably, wherein the RFID chip ( 2) is enclosed within the stamp plate (1) and stamp plate (1), preferably for a hand stamp, with an RFID chip (2) connected substantially inseparably to the stamp plate (1) as an identification feature, wherein the RFID chip (2) is enclosed within the stamp plate (1).
    公开号:AT519404A1
    申请号:T51101/2016
    申请日:2016-12-05
    公开日:2018-06-15
    发明作者:
    申请人:Colop Stempelerzeugung Skopek Gmbh & Co Kg；
    IPC主号:
    专利说明:

    The invention relates to a method for securing an RFID chip as an identification feature on a stamp plate, preferably for a hand stamp, wherein the RFID chip is connected to the stamp plate substantially inextricably.
    The invention furthermore relates to a stamp plate, preferably for a hand stamp, with an RFID chip, which is connected to the stamp plate substantially inseparably, as an identification feature.
    The connection of RFID chips (Radio Frequency Identification Chips) with stamp plates or text plates in order to identify the latter as clearly as possible based on the information stored in the RFID chip is known from CN 201913899 U. Here, a stamp plate with a recess in the surface disclosed in which an RFID chip is glued substantially insoluble. The RFID chip may contain a unique identification number of a stamp associated with the stamp plate and is not to be separated from the stamp plate nondestructively. However, for a reliable identification of the stamp plate is desirable that the RFID chip is not only firmly connected to the stamp plate, but also as reliable as possible protected against damage, as damage to the RFID chip, the stamp plate can not be reliably identified.
    It is an object of the invention to provide a method as described above, with which an RFID chip is both reliably and permanently connected to the stamp plate, and as reliable as possible from damage or attempts to remove the RFID chip, protected becomes.
    In addition, it is an object of the invention to provide a stamp plate as stated above, which has a permanently connected and as reliably protected from damage or theft RFID chip.
    For this purpose, the invention provides a method as in claim 1 and a stamp plate as defined in claim 11. Advantageous embodiments and further developments are specified in the dependent claims.
    With regard to the method, it is provided according to the invention that the RFID chip is enclosed within the stamp plate. The method thus serves a secure connection of an RFID chip with a stamp plate, the terms "safe" or "fuse" are to be understood so that the RFID chip on the one hand can not be removed from the stamp plate nondestructive and on the other hand largely from damage is protected. The stamp plate is preferably intended for use in hand punches. As is known to the person skilled in the art, the RFID chip or RFID transponder has information or data that can be read out of the RFID chip, in particular contactlessly, via a suitable reading device. This data can serve as an identification feature for the stamp plate. Thus, the authenticity of the stamp plate can be checked with the RFID chip. The function of an RFID chip or an RFID system is well known, so that a more detailed description of the same can be dispensed with. For secure reception of the RFID chip, it is included according to the invention within the stamp plate to be produced, i. the process of enclosure occurs during the manufacture of the stamp plate. The RFID chip can be integrated in particular in different stages of production of the stamp plate, in which this example, is partially made. The enclosed RFID chip is preferably completely covered by the stamp plate, i. it is preferably completely integrated in the stamp plate. In this way, the RFID chip can not be removed from the stamp plate without damaging the stamp plate or the RFID chip itself. In addition, the probability of unintentional damage to the RFID chip is reduced by its inclusion in the interior of the stamp plate.
    According to a preferred embodiment of the invention, it is provided that the RFID chip is enclosed by a curing potting material, preferably polyoxymethylene. The potting material, which at temperatures well above the
    Room temperature is fluid and is in a cured state at room temperature, preferably has a high pressure resistance and high rigidity. Polyoxymethylene (POM), which is a thermoplastic, is also well-suited for injection molding. Depending on its arrangement, the RFID chip can be partially or completely surrounded or enveloped by the curing potting material with respect to the stamp plate to be produced. A partial encapsulation with the potting material is useful when part of the surface of the RFID chip is in contact with a part of the stamp plate being manufactured. The hardening or hardened encapsulation material enclosing the RFID chip can contact at least part of the surface of the RFID chip directly, ie the RFID chip can be at least partly covered or cast in directly by the encapsulation material but not limited thereto. The cured potting material enclosing the RFID chip is part of the stamp plate.
    In order to position the RFID chip reliably with respect to the stamp plate, it is favorable if the RFID chip, before being enclosed by the potting material, is received in a holding device, in particular a clamping device, which is part of the stamp plate, preferably in a casting process. The RFID chip received in the holding device is thus arranged at a defined position in the stamp plate to be produced and reliably held in this position before and during the process of enclosing. The holding device can be designed as a clamping device, for example in the form of a bag, wherein the RFID chip is then inserted into the clamping device or pocket before it is enclosed. The holding device is a part of the stamp plate and is preferably made together with a part of the stamp plate. For example, the holding device can be formed on a hardened portion of the stamp plate, in particular glued, or cast together with a portion of the stamp plate. After receiving the RFID chip in the holding device of the RFID chip is preferably covered with the holding device and optionally with additional areas of the partially manufactured stamp plate by means of the potting material. In particular, a stamp plate or text plate or a part thereof can be produced with a pocket for receiving the RFID chip in an injection molding process. In a further method step, the stamp plate is fed to an injection molding machine, whereby the RFID chip is inserted into the pocket, either automatically or manually, and is overmolded with plastic. As an alternative to overmolding with plastic, an adhesive material or potting resin can be used, in which case no second injection molding machine is required.
    Alternatively it can be provided that the RFID chip, before being enclosed by the potting material, in a provided for casting the die plate cavity of a molding tool by means of removable from the cavity retaining pins, preferably substantially in the middle of the cavity, is held. In this case, the RFID chip is poured during the casting of the stamp plate in this. For the casting of the stamp plate a mold with a cavity is provided in a known manner, in which cavity introduced pourable potting material, in particular injected. In order to stably position the RFID chip in a suitable position, favorably approximately in the middle of the cavity, the retaining pins are provided, which protrude into the cavity and expediently abut against two opposite sides of the RFID chip. The retaining pins are removed from the cavity prior to the curing of the potting material.
    To cause unwanted recesses or holes in the cured potting material caused by the retention pins, i. in the stamp plate to avoid, it is advantageous if the cavity is partially filled with the RFID chip held therein with the potting material, then the retaining pins are removed from the cavity and then the cavity is completely filled with the potting material , The retaining pins are preferably slidably received in the mold and are removed after a partial or almost complete filling of the cavity with potting material from the cavity. The RFID chip is held by the potting material surrounding it in his position previously defined by the retaining pins. At least the vacated by the removed retaining pins space in the cavity is filled by further or complete filling with potting material.
    In a moderately favorable embodiment of the invention can be provided that the RFID chip is covered for enclosing with a cover body of the stamp plate. The RFID chip, in this case, preferably rests on an already hardened part of the stamp plate, whereby the surface of the RFID chip which is not yet resting on the stamp plate is covered by the covering body. The cover body is part of the stamp plate and preferably stably designed to prevent damage from the outside. In order to secure the RFID chip in the stamp plate, the cover body, which is formed for example in the form of a lid or a partially open container, in the position covering the RFID chip firmly and permanently connected to the rest of the stamp plate. Even if the cover body itself may be formed as an independent component, it is part of the stamp plate in the context of the invention.
    In order to secure the RFID chip particularly reliably, it can be provided that the RFID chip is covered by the curing potting material with a cover body of the stamp plate enclosing the RFID chip before being enclosed. In order to avoid repetition in the description, regarding the arrangement of the RFID chip with respect to the stamp plate and the arrangement of the cover body, reference is made to the above description of the embodiment in which the RFID chip for encasing is covered with a cover body of the stamp plate , The RFID chip can thus be enclosed both by the covering body and by the hardening potting material. In this case, the potting material can contact a part of the RFID chip directly if the cover body does not completely cover the RFID chips. However, the cover body preferably completely covers the RFID chip. For receiving the RFID chip in the stamp plate, it is advantageous if the RFID chip, before being covered with the cover body, received in a holding device, in particular a clamping device, for example, is inserted, with which
    Holding device of the cover body is permanently connected. Again, the holding device which is part of the stamp plate, for example in the form of a pocket-shaped clamping device, the recording and holding the RFID chip at a defined position in the stamp plate to be produced. For example, the RFID chip is inserted into the pocket. With regard to details of the holding device can be made to the above description. After receiving the RFID chip in the holding device, the RFID chip is covered with the cover body and thus integrated into the stamp plate. The cover body is firmly and permanently connected to the holding device and thus is itself part of the stamp plate.
    The RFID chip can be particularly easily and reliably integrated into the stamp plate when the cover body is positively connected to the holding device, preferably locked. Conveniently, the holding device and the cover body are formed so as not to be separable from each other after the connection without destroying parts of the stamp plate.
    According to an alternative embodiment of the method may be provided for securing the RFID chip that two parts of a two-piece stamp plate, with a recess for the RFID chip in at least one of the parts, manufactured, in particular cast, the RFID chip in the recess is received and the two parts, for enclosing the RFID chip, connected to each other substantially insoluble, in particular glued. For this purpose, at least two parts of the stamp plate are first manufactured as an intermediate product, for example cast, of which at least one has a recess for the RFID chip. After insertion of the RFID chip into the recess, the at least two parts of the stamp plate are connected to each other as inseparably as possible. For the production of a stable, the impression as little as possible by bending the stamp plate, it may be low wine when the stamp plate made of a plastic, preferably Polyoxyme-thylene, in particular cast. Polyoxymethylene-len, which is well suited for injection molding as already mentioned, has a melting point of above 150 ° C and is solid at room temperature. Polyoxymethylene is also good for ink absorption of a color material, in particular inked ink pads and suitable for the color to a paper to be printed. Polyoxymethylene is also suitable for introducing an individual engraving by means of a laser. The stamping plate made of polyoxymethylene can be used instead of a rubber stamp plate. The RFID chip is therefore also in the embodiment described above, according to which the stamp plate is in two parts, with a recess for the RFID chip, made of a plastic, preferably polyoxymethylene, produced, in particular cast, from a curing potting material, preferably polyoxymethylene , surround.
    Thus, according to the invention, the RFID chip is enclosed within the stamp plate. The advantages that result from including or integrating the RFID chip into the stamp plate have been described above in the context of the method; In particular, the RFID chip is permanently accommodated in the stamp plate and can not be removed without destroying it. In addition, it is largely protected in the stamp plate from damage. In this case, the RFID chip is preferably free from gluing, i. taken up without an arrangement of a separate adhesive layer between the RFID chip and the stamp plate in this.
    The RFID chip is particularly securely received in the stamp plate when the RFID chip is cast into the stamp plate. As described above in connection with the method for securing an RFID chip, the RFID chip for this purpose can be recorded in a holding device of the stamp plate and covered with potting material, such as the material for the stamp plate. Alternatively, the RFID chip can be received in a cavity of a mold for the stamp plate and be completely encapsulated with the material of the stamp plate during the process of casting the stamp plate.
    In order not to burden the RFID chip by a casting process, it may be favorable if the RFID chip is received in a holding device of the stamp plate and covered with a covering body, in particular insoluble. For further details on the holding device and the cover body, reference is made to the above description. The RFID chip may also be cast in the stamp plate in addition to covering with the cover body. Advantageously, then covers the potting material, preferably polyoxymethylene, through which the RFID chip is enclosed, the cover body completely or partially.
    According to a further alternative embodiment of the stamp plate, the RFID chip can be accommodated in a recess between two parts of the stamp plate which are fixedly connected to one another and preferably glued. As described above, the two or even more parts of the stamp plate can be fabricated in advance as intermediates, wherein at least a part has a recess for the RFID chip. After the introduction of the RFID chip in the recess, the parts are firmly connected. As an alternative to gluing the parts of the stamp plate, the RFID chip can be received in a recess between two or more parts of the stamp plate that are firmly connected to one another by a positive connection, in particular a snap connection.
    The invention will be further elucidated below on the basis of preferred non-limiting exemplary embodiments with reference to the drawing. Show it:
    1 shows a stamp plate in a partially sectioned view with an RFID chip enclosed therein;
    2A shows a still unfinished stamp plate with a holding device, in which an RFID chip is introduced;
    FIG. 2B shows the unfinished die plate from FIG. 2A with the holding device in which the RFID chip has already been inserted; FIG.
    3A to 3C, a mold for casting a stamp plate, in the cavity of an RFID chip is inserted;
    FIG. 3D shows a perspective view and a sectional view of a stamp plate with an RFID chip embedded therein; FIG.
    4A to 4C show a still unfinished stamp plate with a holding device, in which an RFID chip is inserted and covered with a cover body; and
    5 shows a stamp plate in a partially sectioned view with an RFID chip enclosed between two halves of the stamp plate.
    Fig. 1 shows a per se known in its basic form, e.g. in plan view round, mounted on a support 11 stamp plate 1, which is connected, for example, with a not shown, known hand stamp. (For a known stamp plate, see, for example, PCT application WO 2004/045856 A1 to Colop Stempelproduktion Skopek Gesellschaft m.b.H & CO. KG.) An RFID chip 2 is secured in the stamp plate 1. The RFID chip 2 is enclosed or integrated in the stamp plate 1 and, in the example of FIG. 1, is surrounded on all sides by the material of the stamp plate 1. Thus, the RFID chip 2 is substantially permanently connected to the stamp plate 1. The stamp plate 1 has in known manner an impression side 3, which can be provided in a further process step with an individual engraving, not shown. The stamp plate 1 can also be other shapes, e.g. oval, rectangular, etc., as known per se.
    2A shows an unfinished stamp plate 1, which has a holding device 4, in particular a pocket 4b serving as a clamping device 4a, into which the RFID chip 2 is received by a potting material V prior to encasing. The holding device 4 is produced as part of the stamp plate 1, preferably in a casting process. The RFID chip 2 is included after its inclusion in the holding device 4, which state is shown in Fig. 2B, in a further process step by the curing potting material V, preferably polyoxymethylene, or potting resin. The potting material V is shown in dashed lines in Fig. 2B.
    FIGS. 3A to 3C show a mold 5 with a cavity 6 in a sectional view, in which cavity 6 an RFID chip 2 is accommodated. The mold 5 is provided for casting the stamp plate 1 and thereby for enclosing the RFID chip 2 in the potting material V. Fig. 3A shows the RFID chip 2 even before it is encased by the potting material V in the cavity 6, wherein the RFID chip 2 by means of removable from the cavity 6 retaining pins 7, preferably substantially in the middle of the cavity 6, is held , In FIG. 3B, the cavity 6 has already been at least partially filled with potting material V, while the RFID chip 2 is still held in place with the retaining pins 7. According to Fig. 3C, the retaining pins 7 have already been removed from the cavity 6, and then the cavity 6 is completely filled with the potting material V.
    FIG. 3D shows the stamp plate 1 cast in the mold 5 with the RFID chip 2 enclosed therein in a perspective view and a sectional view, wherein the gate part A still to be removed can also be seen.
    4A to 4C show a partially manufactured stamp plate 1 with a holding device 4, in particular a clamping device 4a in the form of a pocket 4b, in which the RFID chip 2 to be enclosed is at least partially inserted, whereafter it is covered with a covering body 8 of the stamp plate 1 and is thus safely recorded. In particular, FIG. 4A shows the RFID chip 2 after insertion into the holding device 4, FIG. 4B shows the covering body 8 during the covering of the RFID chip 2 and FIG. 4C shows the stamp plate 1 with the RFID chip covered by the covering body 8 2. The cover body 8, for example, a cover plate is inseparable from the holding device 4, preferably positively connected, in particular latched. Suitable embodiments of such a holding device 4 are known in the art. In order to receive the RFID chip 2 particularly securely in the stamp plate 1, the RFID chip 2 covered by the cover body 8 can additionally be covered by encapsulation material V or enclosed thereby, see FIG. 4C, in which the encapsulation material V is shown in dashed lines.
    5 shows two parts 1a, 1b of a two-part stamp plate 1, with a recess 9 for the RFID chip 2. The recess 9 is made in one of the parts, in Fig. 5 in the lower part lb, in particular by casting, they can but also in the upper part la or in both parts la, lb be provided. After the RFID chip 2 has been received in the recess 9, preferably without bonding to one of the parts 1a, 1b, the two parts 1a, 1b, for enclosing the RFID chip 2, are connected to one another essentially inseparably, in particular adhesively bonded, Ultra -Sound-welded or locked. In Fig. 5 snap connection elements 10 for connecting the parts la, lb are indicated with a punch plate carrier 11.
    权利要求:
    Claims (15)
    [1]
    Claims:
    1. A method for securing an RFID chip (2) as an identification feature on a stamp plate (1), preferably for a hand stamp, wherein the RFID chip (2) with the stamp plate (1) is connected substantially inseparable, characterized in that the RFID chip (2) is enclosed within the stamp plate (1).
    [2]
    2. The method according to claim 1, characterized in that the RFID chip (2) by a curing potting material (V), preferably polyoxymethylene, is included.
    [3]
    3. The method according to claim 2, characterized in that the RFID chip (2), before inclusion by the potting material (V), in a holding device (4), in particular a clamping device (4a) is received, which as part the stamp plate (1), preferably in a casting process, is produced.
    [4]
    4. The method according to claim 2, characterized in that the RFID chip (2), before encapsulation by the potting material (V), provided in a casting of the stamp plate (1) cavity (6) of a mold (5) by means of the cavity (6) removable retaining pins (7), preferably substantially in the middle of the cavity (6) is held.
    [5]
    5. The method according to claim 4, characterized in that the cavity (6) with the held therein RFID chip (2) with the potting material (V) is partially filled, then the retaining pins (7) from the cavity (6) are removed and then the cavity (6) is completely filled with the potting material (V).
    [6]
    6. The method according to claim 1, characterized in that the RFID chip (2) for enclosing with a covering body (8) of the stamp plate (1) is covered.
    [7]
    7. The method according to claim 2, characterized in that the RFID chip (2) before enclosing by the curing potting material (V) with a RFID chip (2) enclosing cover body (8) of the stamp plate (1) covered becomes.
    [8]
    8. The method according to claim 6 or 7, characterized in that the RFID chip (2), before being covered with the cover body (8), received in a holding device (4), in particular a clamping device (4a), for example, is inserted with which holding device (4) of the cover body (8) is permanently connected.
    [9]
    9. The method according to claim 8, characterized in that the cover body (8) with the holding device (4) positively connected, preferably latched.
    [10]
    10. The method according to claim 1, characterized in that two parts (1a, 1b) of a two-part stamp plate (1), with a recess (9) for the RFID chip (2) in at least one of the parts (la, lb), manufactured, in particular cast, the RFID chip (2) is received in the recess (9) and the two parts (la, lb), for enclosing the RFID chip (2), connected to each other substantially insoluble, in particular glued ,
    [11]
    11. The method according to any one of claims 1 to 10, characterized in that the stamp plate (1) made of a plastic, preferably polyoxymethylene, prepared, in particular cast.
    [12]
    12. stamp plate (1), preferably for a handstamp, with a with the stamp plate (1) substantially inextricably linked RFID chip (2) as an identification feature, characterized in that the RFID chip (2) within the stamp plate (1) is included.
    [13]
    13. Stamp plate (1) according to claim 12, characterized in that the RFID chip (2) is cast into the stamp plate (1).
    [14]
    14. Stamp plate (1) according to claim 12 or 13, characterized in that the RFID chip (2) in a holding device (4) of the stamp plate (1) is received and covered with a cover body (8), in particular insoluble.
    [15]
    15. stamp plate (1) according to claim 12, characterized in that the RFID chip (2) in a recess (9) between two firmly interconnected, preferably glued parts (1a, 1b) of the stamp plate (1) is added.
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    同族专利:
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    AT519404B1|2020-12-15|
    CN108146087B|2021-06-11|
    CN108146087A|2018-06-12|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    EP1052594A1|1999-05-14|2000-11-15|Sokymat S.A.|Transponder and molding die, and their method of manufacture|
    CN201317165Y|2008-08-21|2009-09-30|北京市印章艺术公司|External hanging anti-counterfeiting stamp with induction chip|
    WO2011020282A1|2009-08-15|2011-02-24|Li Jiashan|Seal with electronic identifying function|
    CN201506089U|2009-09-22|2010-06-16|董保信|A chip network stamp|
    CN201784268U|2010-09-10|2011-04-06|三胜文具厂股份有限公司|Seal with identification chip|
    CN201913899U|2010-10-22|2011-08-03|杭州华杭科技有限公司|Anti-fake stamp surface|
    CN201856458U|2011-01-28|2011-06-08|张保华|Multifunctional stamp|
    CN202186139U|2011-07-27|2012-04-11|卓达印章器材有限公司|Stamp|
    CN204414835U|2015-01-14|2015-06-24|李嘉善|A kind of plastic stamp containing being marked with electronic chip|AT523197A1|2019-11-28|2021-06-15|Colop Stempelerzeugung Skopek Gmbh & Co Kg|Plate carrier|CN2879284Y|2005-11-04|2007-03-14|胡宝林|Wireless electric identification print|
    DE102010020969A1|2010-05-19|2011-11-24|Bundesdruckerei Gmbh|Inlay for a value and / or security document and method for its production|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    ATA51101/2016A|AT519404B1|2016-12-05|2016-12-05|Method for securing an RFID chip and stamp plate|ATA51101/2016A| AT519404B1|2016-12-05|2016-12-05|Method for securing an RFID chip and stamp plate|
    CN201711256853.1A| CN108146087B|2016-12-05|2017-12-04|Method for fixing RFID chip and seal plate|
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